ELPEPCB Etch Resists, Plating Resists and Elpemer Photoresists

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness. Elpemer® photoresists provide excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced wastewater contamination and longer standing time of the stripper solution.

SD 2054

• Negative photoimageable etch and plating resist applied by screen printing.
• Excellent wetting and flow properties, excellent adhesion, and high surface hardness.
• Very low exposure energy, fast drying.
• Tack-free surface when dried, thus easily stackable.
• Aqueous-alkaline developable.
• Resistant to acid and alkaline etch and plating baths up to approx. pH 9.
• Alkaline strippable. Decomposes in filterable flakes when stripped, easily filtered.

Thermal Curing Etch and Plating Resists

SD 2052 AL

• Screen Printable positive etch resist.
• Resistant to alkaline etching baths up to pH 9.
• High-definition resist enabling fine line traces
• Excellent adhesion and high surface hardness.
• Alkaline strippable.

Aurosit 2149 series

Plating resist for use in Secondary Imaging Technology (SIT), protects metal surfaces during electroless Ni/Au process (ENiG), thus enabling an additional OSP surface finish.

• Good adhesion to copper and solder resists.
• Screen printable high-definition liquid, thermally cured resists.
• Enables accurate reproduction of 150 µm structures.
• Good adhesion to copper and solder resists.
• Easily stripped in alkaline media.