December 15, 2016
New Dry Film Lamination Technology Improves Yield, Increases Productivity and Maximizes ROI
Visit us at BOOTH #3701
The new 630NP laminator optimizes the Direct Image transfer of very fine lines on the latest HSLL laminates with Super Low Profile Copper surfaces.
This is made possible by the new Lamination Module with its EVEN heat and EVEN pressure across the entire surface of the laminated panel.
The ability to change the rubber lamination rolls in seconds will not only increase productivity but will also offer alternative “quick change” rubber solutions for different product needs.
This complete redesign of the film lamination approach has raised the bar, allowing for higher PRODUCTIVITY and YIELD… surpassing all traditional ROI expectations.
